AEC Q-100 / Q-101 qualification for ICs and discretes in ADAS, powertrain, and body control.
MIL-STD hi-rel screening for avionics, space, and defence electronics.
Device reliability verification with full traceability for ISO 13485 QMS environments.
Burn-in and HTOL for GPU silicon, power management ICs, and GaN/SiC devices.
HAST, THB, and HTOL for 5G infrastructure, optical, and high-speed SerDes ICs.
AEC Q-100 · AEC Q-101
Automotive semiconductor qualification demands the most rigorous reliability evidence of any commercial market. AEC Q-100 Grade 0 devices must demonstrate functionality from -40°C to +175°C, survive extended life test durations, and pass every item in a comprehensive stress test matrix before any Tier 1 or OEM will consider them for a design-in.
Reltech supports the complete AEC Q-100 and Q-101 qualification matrix — from HTOL and HAST through to Temperature Cycling, ESD, Latch-Up, and Preconditioning. Our engineers understand the requirements and deliver a fully traceable qualification for you.
MIL-STD-883 · MIL-PRF-38535
Hi-rel screening for aerospace and defence applications requires both technical rigour and comprehensive documentation. Devices operating in avionics, satellite, and defence electronic systems must demonstrate reliability under extreme temperature ranges, radiation environments, and long mission lifetimes — often measured in decades.
Reltech provides LTOL and HTOL screening to MIL-STD-883 methods, burn-in to customer DPA and SCD requirements, and Class B and Class S screening flows.
ISO 13485 · IEC 60068
Medical device semiconductor reliability is governed by the need for absolute traceability and zero-defect outgoing quality. Whether your device is destined for an implantable cardiac monitor or a point-of-care diagnostic instrument, the reliability evidence must be unimpeachable — and the test laboratory that generated it must be demonstrably competent.
Reltech’s ISO 17025 accreditation provides the independent third-party validation your regulatory submission requires. We provide full device-level traceability, and test reports formatted for IEC 60068 and JEDEC JESD22 compliance.
GaN · SiC · Advanced Node
AI compute hardware and power electronics represent two of the fastest-growing reliability testing markets. Advanced node logic devices running at the power densities demanded by AI workloads need accelerated HTOL characterisation and burn-in screening to demonstrate reliability before data centre operators will accept them. Power devices — GaN, SiC, and silicon — require power cycling as well as conventional HTOL.
Reltech’s high channel-count HTOL capability handles advanced node characterisation. Our power cycling test capability addresses wide-bandgap device fatigue mechanisms that conventional oven-based tests cannot replicate.
Telcordia GR-468 · GR-1209
5G infrastructure, optical communication, and network switching place extreme demands on semiconductor device reliability. System uptime requirements in telecom translate directly into FIT rate targets for every component in the signal chain — and operators demand documented evidence, not just design claims.
Reltech provides HAST and THB for moisture reliability of high-speed SerDes and RF front-end devices, HTOL programmes for FIT rate data generation to Telcordia GR-468 and GR-1209 requirements, and Temperature Cycling for optical module solder joint qualification.
